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BAL99LT1 Switching Diode
Features
* Pb-Free Package is Available
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MAXIMUM RATINGS
Rating Continuous Reverse Voltage Peak Forward Current Symbol VR IF Value 70 100 Unit Vdc mAdc
ANODE 3
CATHODE 2
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
3 1 2
SOT-23 CASE 318 STYLE 18
THERMAL CHARACTERISTICS
Characteristic Total Device Dissipation FR- 5 Board (Note 1), TA = 25C Derate above 25C Thermal Resistance, Junction-to-Ambient Total Device Dissipation Alumina Substrate, (Note 2) TA = 25C Derate above 25C Thermal Resistance, Junction-to-Ambient Junction and Storage Temperature Symbol PD Max 225 1.8 RqJA PD 556 300 2.4 RqJA TJ, Tstg 417 -55 to +150 Unit mW mW/C C/W mW mW/C C/W C JF M Specific Device Code = Date Code JF M
MARKING DIAGRAM
1. FR-5 = 1.0 0.75 0.062 in. 2. Alumina = 0.4 0.3 0.024 in 99.5% alumina.
ORDERING INFORMATION
Device BAL99LT1 BAL99LT1G Package SOT-23 SOT-23 (Pb-Free) Shipping 3000 / Tape & Reel 3000 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
(c) Semiconductor Components Industries, LLC, 2004
1
July, 2004 - Rev. 3
Publication Order Number: BAL99LT1/D
BAL99LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic OFF CHARACTERISTICS Reverse Voltage Leakage Current (VR = 70 Vdc) (VR = 25 Vdc, TJ = 150C) (VR = 70 Vdc, TJ = 150C) Reverse Breakdown Voltage, (IR = 100 mAdc) Forward Voltage, (IF = 1.0 mAdc) (IF = 10 mAdc) (IF = 50 mAdc) (IF = 150 mAdc) Recovery Current, (IF = 10 mAdc, VR = 5.0 Vdc, RL = 500 W) Diode Capacitance, (VR = 0, f = 1.0 MHz) Reverse Recovery Time, (IF = IR = 10 mAdc, RL = 100 W, measured at IR = 1.0 mAdc) Forward Recovery Voltage, (IF = 10 mAdc, tr = 20 ns) IR - - - V(BR) VF - - - - QS CD trr VFR - - - - 715 855 1000 1250 45 1.5 6.0 1.75 pC pF ns Vdc 70 2.5 30 50 - Vdc mV mAdc Symbol Min Max Unit
TYPICAL CHARACTERISTICS
100 IF, FORWARD CURRENT (mA) I R, REVERSE CURRENT ( A) 10 TA = 150C 1.0 TA = 125C
10 TA = 85C 1.0 TA = 25C TA = -40C 0.1 0.2 0.4 0.6 0.8 1.0 1.2
0.1
TA = 85C TA = 55C
0.01 TA = 25C 0 10 20 30 40 50 VR, REVERSE VOLTAGE (VOLTS)
0.001
VF, FORWARD VOLTAGE (VOLTS)
Figure 1. Forward Voltage
0.68 CD , DIODE CAPACITANCE (pF)
Figure 2. Leakage Current
0.64
0.60
0.56
0.52
0
2
4
6
8
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Capacitance
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BAL99LT1
PACKAGE DIMENSIONS SOT-23 (TO-236) CASE 318-08 ISSUE AH
A L
3 1 2
BS
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. 318-03 AND -07 OBSOLETE, NEW STANDARD 318-08. INCHES MIN MAX 0.1102 0.1197 0.0472 0.0551 0.0350 0.0440 0.0150 0.0200 0.0701 0.0807 0.0005 0.0040 0.0034 0.0070 0.0140 0.0285 0.0350 0.0401 0.0830 0.1039 0.0177 0.0236 MILLIMETERS MIN MAX 2.80 3.04 1.20 1.40 0.89 1.11 0.37 0.50 1.78 2.04 0.013 0.100 0.085 0.177 0.35 0.69 0.89 1.02 2.10 2.64 0.45 0.60
V
G C D H K J
DIM A B C D G H J K L S V
STYLE 18: PIN 1. NO CONNECTION 2. CATHODE 3. ANODE
SOLDERING FOOTPRINT*
0.95 0.037
0.95 0.037
2.0 0.079 0.9 0.035 0.8 0.031
SCALE 10:1 mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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BAL99LT1
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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BAL99LT1/D

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